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Produkte:
SMD-Kondensatoren
Kondensatoren im RM 2.5 mm 
Kondensatoren im RM 5 mm 
Film/Folien-Kondensatoren im RM 7.5 - 15 mm 
Metallisierte Kondensatoren im RM 7.5 - 37.5 mm 
Impulskondensatoren 
Funk-Entstörkondensatoren 
Snubber Kondensatoren 
GTO Kondensatoren 
DC-Link Kondensatoren 
SuperCaps 

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Übersicht

 

MKP-X2

 

MKP-X2 R

 

MKP-Y2

 

MP3-X2

 

MP3-X1

 

MP3-Y2

 

MP3R-Y2

 
 

 

Typical Dimensions for Taping Configuration

 

 
  Dimensions for radial insertion
Designation Symbol PCM 2.5 PCM 5 PCM 7.5 PCM 10** PCM 15** PCM 22.5 PCM 27.5
Carrier tape width W 18.0±0.5 18.0±0.5 18.0±0.5 18.0±0.5 18.0±0.5 18.0±0.5 18.0±0.5
Hold-down tape width W0 6.0 for hot-sealing adhesive tape 6.0 for hot-sealing adhesive tape 12.0 for hot-sealing adhesive tape 12.0 for hot-sealing adhesive tape 12.0 for hot-sealing adhesive tape 12.0 for hot-sealing adhesive tape 12.0 for hot-sealing adhesive tape
Hole position W1 9.0±0.5 9.0±0.5 9.0±0.5 9.0±0.5 9.0±0.5 9.0±0.5 9.0±0.5
Hold-down tape position W2 0.5 to 3.0 max. 0.5 to 3.0 max. 0.5 to 3.0 max. 0.5 to 3.0 max. 0.5 to 3.0 max 0.5 to 3.0 max. 0.5 to 3.0 max.
Feed hole diameter D0 4.0±0.2 4.0±0.2 4.0±0.2 4.0±0.2 4.0±0.2 4.0±0.2 4.0±0.2
Pitch of component P 12.7±1.0 12.7±1.0 12.7±1.0 25.4±1.0 25.4±1.0 38.1±1.5 *38.1±1.5 or 50.8±1.5
Feed hole pitch P0 12.7±0.3 cumulative pitch error max. 1.0mm/20pitch 12.7±0.3 cumulative pitch error max. 1.0mm/20pitch 12.7±0.3 cumulative pitch error max. 1.0mm/20pitch 12.7±0.3 cumulative pitch error max. 1.0mm/20pitch 12.7±0.3 cumulative pitch error max. 1.0mm/20pitch 12.7±0.3 cumulative pitch error max. 1.0mm/20pitch 12.7±0.3 cumulative pitch error max. 1.0mm/20pitch
Feed hole centre to lead P1 5.1±0.5 3.85±0.7 2.6±0.7 7.7±0.7 5.2±0.7 7.8±0.7 5.3±0.7
Hole centre to component centre P2 6.35±1.3 6.35±1.3 6.35±1.3 12.7±1.3 12.7±1.3 19.05±1.3 19.05±1.3
Feed hole centre to bottom edge of the component H 16.5±0.3 16.5±0.3 16.5±0.3 16.5±0.3 16.5±0.3 16.5±0.3 16.5±0.3
18.5±0.5 18.5±0.5 18.5±0.5 18.5±0.5 18.5±0.5 18.5±0.5 18.5±0.5
Feed hole centre to top edge of the component H1 H+Hcomponent < H1 32.25 max. H+Hcomponent < H1 32.25 max. H+Hcomponent < H1 24.25 to 31.5 H+Hcomponent < H1 25.0 to 31.5. H+Hcomponent < H1 26.0 to 37.0 H+Hcomponent < H1 30.0 to 43.0 H+Hcomponent < H1 35.0 to 45.0
Lead spacing F 2.5±0.5 5+0.8/-0.2 7.5±0.8 10.0±0.8 15.0±0.8 22.5±0.8 27.5±0.8
Lead diameter d 0.4±0.05 0.5±0.05 *0.5±0.05 or 0.6+0.06/-0.05 *0.5±0.05 or 0.6+0.06/-0.05 0.8+0.08/-0.05 0.8+0.08/-0.05 0.8+0.08/-0.05
Component alignment h ±2.0 max. ±2.0 max. ±3.0 max. ±3.0 max. ±3.0 max. ±3.0 max. ±3.0 max.
Total tape thickness t 0.7±0.2 0.7±0.2 0.7±0.2 0.7±0.2 0.7±0.2 0.7±0.2 0.7±0.2
Package   ROLL / AMMO / REEL AMMO / REEL
**Diameter of leads see General Data.
**PCM 10 and PCM 15 can be crimped to PCM 7.5 mm.
**Position of components according to PCM 7.5 (sketch 1). P0 = 12.7 or 15.0 is possible.

Dims. in mm.
Minimum packing units for capacitors with radial leads
Please clarify customer-specific deviations with the manufacturer.